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HANDYLINK?
APPLICATION SPECIFICATION
4.3 Clearances Between Mated Parts
The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the
final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage. Please see
Section 6.4 Design Best Practices for further detailed information.
5.0 SOLDERING PROCESS RECOMMENDATIONS
5.1 44828 SMT Receptacle Connector
5.1.1 PCB Layout
See the applicable Sales Drawing for an illustration of the recommended PCB layout. Contact Molex if further assistance is required.
5.1.2 Solder Paste Stencil Layout
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.
5.1.3 Reflow Profile
While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow
profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.
5.1.4
Inspection
Solder joints should be inspected using established conventional methods.
5.2 45560 SMT Cradle Connector
5.2.1 PCB Layout
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts. Contact Molex if further assistance is
required.
5.2.2 Solder Paste Stencil Layout
See Sales Drawing for recommended PCB pad layout and solder paste thickness.
REVISION:
A
ECR/ECN INFORMATION:
EC No: UCP2006- 1391
DATE: 2005/12/13
TITLE:
APPLICATION SPECIFICATION
HANDYLINK?I/O CONNECTOR SYSTEM
SHEET No.
7 of 26
DOCUMENT NUMBER:
SD-45339-001
CREATED / REVISED BY:
M. Simmel
CHECKED BY:
Marc Simmel
APPROVED BY:
Joe Comerci
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
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